DSPG Unveils SparkPA, RF CMOS Power Amplifier for 802.11ac

5 January, 2016

"Our work with TSMC has produced the most advanced and high performance CMOS solution for 802.11ac segment," said Ofer Elyakim, CEO of DSP Group

“Our work with TSMC has produced the most advanced and high performance CMOS solution for 802.11ac segment,” said Ofer Elyakim, CEO of DSP Group

DSPGDSP Group today a surprising product:  a revolutionary RF Power Amplifier (PA) for the high performance and technically challenging 802.11ac Access Point market, callled SparkPA. The  Amplifier is using a standard CMOS Process from TSMC.

The company said that SparkPA achieves more than 100mW of output power at -35db EVM and more than 50 mW at -40db EVM with excellent stability over temperature. When incorporated into access points, SparkPA has been proven to dramatically improve device performance.

SparkPA is positioned to support the new Wave 2 and Wave 3 802.11ac Access Point requirements, including 160 MHz channel, MU-MIMO at 4×4 and 8×8 topologies as well as future 1024 QAM. The CMOS PA allows frequency and linearity configurability per packet.

“Our work with TSMC has produced the most advanced and high performance CMOS solution for 802.11ac segment,” said Ofer Elyakim, CEO of DSP Group. “The 802.11ac power amplifier requirements are considered to be among the most challenging in the RF frontend segment. Our innovative approach allows us to demonstrate groundbreaking EVM noise performance that can deliver the most advanced features required by customers in a cost effective manner. We will continue to innovate and leverage our core expertise in new domains.”

“Our more than a decade-long technology collaboration with DSP Group continues to produce innovative results,” said Maria Marced, President, TSMC Europe. “TSMC looks forward to continuing our collaboration with DSP Group.”

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Posted in: News , Semiconductors , Wireless