Applied Materials launches a 1nm inspection system

13 July, 2016

The new system is based e-beam technology. It delivers a 1nm resolution, critical for R&D, ramp and production control of ≤10nm multiple patterning, FinFET formation, DRAM and 3D NAND devices

The new system is based e-beam technology.  It delivers a 1nm resolution, critical for R&D, ramp and production control of ≤10nm multiple patterning, FinFET formation, DRAM and 3D NAND devices

The new system is based e-beam technology. It delivers a 1nm resolution, critical for R&D, ramp and production control of ≤10nm multiple patterning, FinFET formation, DRAM and 3D NAND devices Applied Materials launches the PROVision™ system, an e-beam technology chip production inspection system. The new system Delivers up to 3x faster throughput for the most challenging e-beam applications. The system is designed for logic, DRAM and 3D NAND customers as they move to advanced nodes. According to Applied Materials, the new system is the only e-beam based system delivering a 1nm resolution. This is critical for R&D, ramp and production control of ≤10nm multiple patterning, FinFET formation, DRAM and 3D NAND devices. The system ensures accurate process characterization, prediction and detection of performance- and yield-limiting defects throughout the fab product life cycle. The PROVision system complements Applied’s e-beam metrology and review products as well as the optical patterned wafer inspection product line. “The PROVision system’s unique combination of high resolution and massive sampling has helped accelerate time to solution and time to market for our advanced nodes,” said Dr. Oh-Jang Kwon, SK hynix R&D EBI Group. The PROVision system has already been delivered to dozens of customers, including some repeat orders from a leading foundry and a major memory producer. Applied Materials ProVision system
Applied Materials PROVision

Applied Materials launches the PROVision™ system, an e-beam technology chip production inspection system. The new system Delivers up to 3x faster throughput for the most challenging e-beam applications. The system is designed for  logic, DRAM and 3D NAND customers as they move to advanced nodes.

According to Applied Materials, the new system is the only e-beam based system delivering a 1nm resolution. This is critical for R&D, ramp and production control of ≤10nm multiple patterning, FinFET formation, DRAM and 3D NAND devices. The system ensures accurate process characterization, prediction and detection of performance- and yield-limiting defects throughout the fab product life cycle. The PROVision system complements Applied’s e-beam metrology and review products as well as the optical patterned wafer inspection product line.

“The PROVision system’s unique combination of high resolution and massive sampling has helped accelerate time to solution and time to market for our advanced nodes,” said Dr. Oh-Jang Kwon, SK hynix R&D EBI Group.

The PROVision system has already been delivered to dozens of customers, including some repeat orders from a leading foundry and a major memory producer.

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Posted in: Electronics Industry , News , Semiconductors

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